October 9th, 2018 ― Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation at the SMT – Info International Conference scheduled to take place on October 16th – October 17th, 2018 in Brno, Czech Republic.
Ales Sedlak, Technical Applications Manager, will present the paper “A Practical Guide to Optimizing Solder Paste Performance for Ultra-fine Feature Printing.” This paper provides a detailed explanation of how to optimize solder paste performance from receiving to reflow. Discussion topics include paste handling, stencil design, printer set up and common defects. The presentation incorporates theory with best practice to inform the process engineer of the how, what and why of solder paste use.
AIM will also highlight its full line of advanced solder materials, including its high reliability alloys, solder paste, liquid flux and solder alloys. To discover all of AIM’s products and services, visit the company at SMT Brno or on their website www.aimsolder.com