Technical Program Finalized for International Conference on Soldering and Reliability
The International Conference on Soldering and Reliability (ICSR) is a highly technical three-day event in Toronto, ON, Canada where soldering and reliability professionals come together to share their knowledge and vision for addressing challenges related to the assembly and reliability of electronics products such as Solder R&D and Applications, Solder Joint Reliability, Technology Trends, Contamination and Cleanliness Testing, Failure Modes and Mitigation, and Defect Detection.
There are 4 workshops announced for Tuesday 6th June, as follows:
WS1: Shining a Light on LED Technology: Construction, Reliability, Qualification, Failure Modes – M. Simard-Normandin, Ph.D., MuAnalysis Inc. June 6, 2017 | 8:30am – 12:00pm
WS2: The Incredible Shrinking World Of Electronics – Are Traditional DFM, DFR, DFF, … Methods Obsolete? – Dale Lee, Plexus Corp. June 6, 2017 | 8:30am – 12:00pm
WS3: Understanding Shock & Vibration – Alec Feinberg, DfR Soft June 6, 2017 | 1:30pm – 5:00pm
WS4: Design for Cleaning and Reliability Excellence – Dale Lee, Plexus Corp. June 6, 2017 | 1:30pm – 5:00pm
Bauer and Bath to Keynote the Conference
On the afternoon of Wednesday, June 7, Dr. Charles Bauer, Techlead Corporation, will deliver his keynote presentation titled “Nanotechnology in Electronics Packaging, Interconnect, and Assembly: Hype or Reality?”
Jasbir Bath, Koki Solder, will speak on “The Importance of Design to Improve Manufacturing Process Yield and Reliability” on Thursday morning during his keynote presentation right before lunch.
For further details about the International Conference on Soldering and Reliability, including the full technical program, visit www.smta.org/icsr/