The die-to-die bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding (UW).
Ultrasonic welding can reduce bonding pressure and temperature. This...
Executives from Intervala and Regional Industrial Development Corporation of Southwestern Pennsylvania (RIDC) joined local officials to celebrate the opening of Intervala’s new 217,000 square-foot...
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, proudly announces its participation in the Satellite 2024 Conference & Exhibition, scheduled...
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced plans to exhibit at SMTconnect, scheduled...
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the SMTA Capital Expo &...
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional...
Planet Computers launches sister business unit – Planet Embedded – retailing embedded systems, industrial and mini-PCs, communication links and core boards
The Planet...
SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in...
IPC's Validation Services Program has awarded an IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements Qualified Manufacturers Listing (QML) to TTM Technologies, Inc.’s San...
TAGARNO, a leading provider of digital microscopes, has developed a new ‘how to’ guide for implementing digital microscopes for soldering and PCB inspection. Magnification...