Indium Corporation’s Adam Murling, Technical Support Engineer, will participate in a virtual miniaturization roundtable hosted by BarTron on Thursday, Dec. 10 at 10 a.m. Eastern Time (3 p.m. British Time/11 p.m. Malaysia Time).
In Process Solution Series Part 2: Industry Progression to Miniaturization, roundtable guests will discuss new manufacturing challenges caused by miniaturization, including those within the printer process, solder paste powder size, placement improvements, and inspection. The roundtable will be followed by a live Q&A.
Murling is responsible for providing leading-edge technical support for customers around the globe through SMT process optimization, material recommendations, and customer training. He nurtures existing accounts and assists in strategy development for obtaining new accounts. Murling also plans and executes customer and internal designs-of-experiments. He is a Certified SMT Process Engineer, an active blogger, and has authored technical papers on wave solder fluxes and solder preforms. Murling has a bachelor’s degree in chemical engineering and a master’s degree in engineering management from Clarkson University.
If you’re looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at www.indium.com/webinar.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.